[12/07/2024] A photo shows the multi die assembly side of an Intel assembled glass substrate test chip at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories.
![[12/07/2024] A photo shows the multi die assembly side of an Intel assembled glass substrate test chip at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories.](/screenshots/1280x1024/2024/07/Intel-glass-substrate-7-pcgh.jpg)
