Intel presents Larrabee Wafer at the IDF - Sample chips ready
At the spring IDF Intel showed a Wafer with Larrabee Dies. Based on the number of Dies one can guess the size.
On the 300 mm Wafer Intel's Senior Vice President Pat Gelsinger presents to the press about 85 Dies are visible. Accordingly one Die should be more than 650 square millimeters big. For comparison: A GT200 has a Die size of about 600 and a RV790 about 290 square millimeters. So the Larrabee seems to be quite complex. Production in 45 nanometers suggests itself since Intel plans the market introduction of Larrabee for late 2009 or early 2010.
The development is said to make good progress. Intel is on schedule to introduce their first discrete graphics solution Larrabee in late 2009 or early 2010. Apparently Intel is already running tests with Larrabee chips in the laboratory.
In our gallery you can find several presentations about Larrabee (e.g. Larrabee's scaling with different cores) that have been published at the IDF.
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