Core i3 Clarkdale: Peek under the heatspreader of the 32nm CPU and 45nm GPU combo
The guys at Tweaktown have removed the heatspreader of a Core i3 Clarkdale to show what the duet of 32nm processor and 45nm graphics unit looks like.
Early next year Intel's Core array for the socket 1156 will be completed with the Clarkdale entry-level processor. It is the first sample of a new CPU family called Westmere, which in contrast to the Nehalem already produced in a 32 nanometer process. Since switching to a new production process is extremely complex, only a few changes are made to the architecture itself - there only are some cosmetic adjustments like additional SIMD commands. The Clarkdale is supposed to come as Core i3-500 as well as Core i3-600 (with additional cores) and place itself below the Lynnfield (i5-700/i5-800), which is always working with four physical cores. According to unofficial information a third version is planned: A Clarkdale with two cores without Hyperthreading was filed as Pentium on unofficial Intel roadmaps.
Although Clarkdale CPUs have a different arrangement of SMD components on the lower side than Lynnfield processors, the actual new thing is hidden beneath the heatspreader. The metal cap covers two differently sized Dies: The smaller one is the dual-core chi which is produced in 32 nanometers. The memory controller and the integrated graphics unit are placed in the bigger one, which is still made in the currently common 45 nanometer process. With the currently available P55 motherboards the graphics unit can't be used since only boards with an H57, H55 or the Q57 (intended for professional purpose) chip will support the required Flexible Display Interface (FDI) and offer a DVI output.
The guys at Tweaktown removed the heatspreader and thus show how the two dies are placed.
More articles related to Clarkdale or Westmere:
• Intel Core i9: Hands-on test of the six-core Gulftown
• Intel Core i5 and Core i7: Lynnfield CPUs reviewed
• Mini-ITX motherboard for Clarkdale CPUs
CPU-Roadmap 2017 - 2018: Künftige AMD- und Intel-CPUs/-APUs in der Übersicht [Februar 2017]